【參展訊息】奇彥科技12/2-12/5 參加 EPTC 2025 展覽會（新加坡）EPTC Singapore

【中文公告】

奇彥科技參加 EPTC 2025 展覽會（新加坡）

奇彥科技股份有限公司（C-TECH Technology Co., Ltd.）將與日本 FINECS 株式會社共同參加 IEEE Electronics Packaging Technology Conference (EPTC 2025)，展示最新的 高導電、高導熱微型銅柱與 i-Pin 封裝技術。

此次展出將聚焦於先進封裝與異質整合應用，包括：

1. 超細間距銅柱（Cu Pillar）與 i-Pin 解決方案

2. 高熱傳導材料與低翹曲設計

3. 智慧製造與可靠度提升技術

展覽日期：2025 年 12 月 3 日～6 日

地點：新加坡 Marina Bay Sands Convention Centre

展位編號：待公告

誠摯邀請各界先進蒞臨參觀指導，一同交流先進封裝技術的未來發展。

展覽資訊：https://eptc-ieee.net/

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【English Version】

C-TECH to Exhibit at EPTC 2025 in Singapore

C-TECH Technology Co., Ltd., in collaboration with FINECS Co., Ltd. (Japan), will participate in the IEEE Electronics Packaging Technology Conference (EPTC 2025) held in Singapore.

We will showcase our latest high-conductivity, high-thermal copper pillar and i-Pin packaging technologies, designed for next-generation semiconductor applications.

Key highlights include:

1. Fine-pitch Cu pillar & i-Pin solutions

2. Advanced thermal management & warpage control

3. High-reliability materials for heterogeneous integration

Date: December 3–6, 2025

Venue: Marina Bay Sands Convention Centre, Singapore

Booth No.: TBA

We look forward to meeting you at EPTC 2025 and exploring future opportunities together.

Exhibition Information:https://eptc-ieee.net/